AMMCW10 Broadcom / Avago RF Amplifier 6 – 20 GHz dB datasheet, inventory, & pricing. Avago Technologies’ AMMC GHz MMIC is an efficient two-stage amplifier designed to be used as a cascadable intermediate gain block for EW. Description Agilent’s AMMC- GHz MMIC is an efficient two- stage amplifier designed to be used as a cascadable intermediate gain block for EW.
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This wmmc simplify the assembly process and reduces assembly related performance variations and costs. No connection to the gate pad is needed for single drain- bias operation.
Minimum Operating Supply Voltage. The recommended supply voltage is 3 to 5 V.
AMMC-5618-W10 Broadcom, RF Amplifier, 14.5 dB 20 GHz, 6-Pin Chip
These a,mc are ESD sensitive. San Pioneer Electronics Co. Personal grounding is to be worn at all times when handling these devices. Thermosonic wedge bonding is the preferred method for wire attachment to 6518 bond pads. 6518 Return Loss and Temperature Figure This can be accomplished by mounting a gold plated metal shim same length and width as the MMIC under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar.
The gate- pad voltage is approximately zero volt during operation with no DC gate supply. Cascadable gain stage for EW systems? The RF input and output have matching circuitry for use in W environments.
In communication systems, it can be used as a LO buffer, or as a transmit driver amplifier.
Please send your question! It is fabricated using a PHEMT integrated circuit structure that provides exceptional efficiency and flat gain performance. The backside of the chip is both RF and DC ground. The location of the RF bond pads is shown in Figure During typical operation with a single 5-V supply, each gain stage is biased for Class-A operation for optimal power output with minimal distortion. To San Pioneer Electronics Co.
For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it.
AMMCW10 Price & Stock | DigiPart
Components are supplied in the original manufacturer’s packaging, ready for insertion into your machinery. What is Production Packaging? Personal grounding is to be worn at all times when handling these devices. This feature is Quick question function, select the corresponding question types, automatically enter the corresponding problem, remove your trouble of typing.
This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet do not pick up die with vacuum on die center. Noise Figure Figure 4. Please 5168 me your price and order 518 terms and delivery time.
Save to parts list Save to parts list. The ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. During typical operation with a single 5- V supply, each gain stage is biased for Class- A operation for optimal power output with 561 distortion.
The backside of the chip is both RF and DC ground.
Please enter a message. Save to an existing parts list Save to a new parts list. For microstripline applications, the chip should be attached directly to the ground plane e. Copyright Agilent Technologies, Inc. For microstripline applications, the chip should be attached directly to the ground plane e. The 5168 supply voltage is 3 to 5 V. Please send me detail product specification, thank you! Name Company Telephone Address Finish. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads.
The product does not contain any of the restricted substances in concentrations and applications banned by the Directive, and for 56118, the product is capable of being worked on at the higher temperatures required by lead—free soldering. The following precautions are strongly recommended: No ground wires are required because all ground connections are made with plated throughholes to the backside of the device.
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Glad to serve you! The foregoing information relates to product sold on, or after, the date shown below. These devices are ESD sensitive. This helps simplify the assembly process and reduces assembly related performance variations and costs. No ground wires are required because all ground connections are made with plated through-holes to the backside of the device.
AVAGO AMMC-5618 RF Amplifier
The amcm of the RF bond pads is shown in Figure Contact Now Chat Now. Output Return Loss and Voltage Figure February 12, EN. The gate-pad voltage is approximately zero volt during operation with no DC gate supply. You have chosen to save the following item to a parts list:.